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July 2005 rev 0.4 2.5V and 3.3V LVCMOS Clock Distribution Buffer
Features
Configurable 10 outputs LVCMOS clock distribution buffer Compatible to single, dual and mixed 3.3V/2.5V Voltage supply Wide range output clock frequency up to 250MHz Designed for mid-range to high-performance telecom, networking and computer applications Supports applications requiring clock redundancy Max. output skew of 200pS (150pS within one bank) Selectable output configurations per output bank Tristatable outputs 32 lead LQFP & TQFP Packages Ambient operating temperature range of -40 to 85C -
ASM2I99446
is specified for the extended temperature range of -40C to 85C. The ASM2I99446 is a full static fanout buffer design supporting clock frequencies up to 250MHz. The signals are generated and retimed on-chip to ensure minimal skew between the three output banks. Two independent LVCMOS compatible clock inputs are available. This feature supports redundant clock sources or the addition of a test clock into the system design. Each of the three output banks can be individually supplied by 2.5V or 3.3V supporting mixed voltage applications. The FSELx pins choose between division of the input reference frequency by one or two. The frequency divider can be set individually for each of the three output banks. The ASM2I99446 can be reset and the outputs are disabled by deasserting the MR/OE pin (logic high state). Asserting MR/OE will enable the outputs.
Functional Description
The ASM2I99446 is a 2.5V and 3.3V compatible 1:10 clock distribution buffer designed for low-voltage mid-range to high-performance telecom, networking and computing applications. Both 3.3V, 2.5V and dual supply voltages are supported for mixed-voltage applications. The ASM2I99446 offers 10 low-skew outputs and 2 selectable inputs for clock redundancy. The outputs are configurable and support 1:1 and 1:2 output to input frequency ratios. The ASM2I99446
All inputs accept LVCMOS signals while the outputs provide LVCMOS compatible levels with the capability to drive terminated 50 transmission lines. Please consult the ASM2I99456 specification for a 1:10 mixed voltage buffer with LVPECL compatible inputs. For series terminated transmission lines, each of the ASM2I99446 outputs can drive one or two traces giving the devices an effective fanout of 1:20. The device is packaged in a 32-lead LQFP and TQFP Packages. 7x7mm2
Alliance Semiconductor 2575, Augustine Drive * Santa Clara, CA * Tel: 408.855.4900 * Fax: 408.855.4999 * www.alsc.com
Notice: The information in this document is subject to change without notice.
July 2005 rev 0.4
Block Diagram
CCLK0 CCLK1 CCLK_SEL VCC 25K 0 VCC 25K 1 CLK CLK-2 0 1 QA0 QA1 QA2 QB0 QB1 QB2
ASM2I99446
25K
0 1
QC0 FSELA FSELB FSELC MR/OE 0 25K 25K 25K 25K 1 QC1 QC2 QC3
Pin Configuration 32 - LEAD PACKAGE PINOUT -- Top View
GND
GND
QB1
QB2
24 23 22 21 20 19 18 17 VCCA QA2 GND QA1 VCCA QA0 GND MR/OE 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 16 15 14 QC3 GND QC2 VCCC QC1 GND QC0 VCCC
ASM2I99446
VCCB
VCCC 13 12 11 10 9 GND
QB0
VCCB
CCLK_SEL
CCLK1
CCLK0
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
FSELA
FSELB
FSELC
VCC
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Table 1: Pin Configuration Pin Number
3,4 5,6,7 32 8,11,15,20,24,27,31 25,29 18,22 9,13,17 2 30,28, 26 23,21,19 10,12,14,16
ASM2I99446
Pin
CCLK0, CCLK1 FSELA, FSELB, FSELC MR/OE GND VCCA, VCCB, VCCC VCC QA0 - QA2 QB0 - QB2 QC0 - QC3
I/O
Input Input Input Output Output Output
Type
LVCMOS LVCMOS LVCMOS Supply Supply Supply LVCMOS LVCMOS LVCMOS
Function
LVCMOS clock inputs Output bank divide select input Internal reset and output (high impedance) control Negative voltage supply (GND) Positive voltage supply for output banks Positive voltage supply for core (VCC) Bank A outputs Bank B outputs Bank C outputs
Note: VCCB is internally connected to VCC.
Table 2: Supported Single and Dual Supply Configurations Supply voltage configuration
3.3V Mixed voltage supply 2.5V
VCC1
3.3V 3.3V 2.5V
VCCA2
3.3V 3.3V or 2.5V 2.5V
VCCB3
3.3V 3.3V 2.5V
VCCC4
3.3V 3.3V or 2.5V 2.5V
VCC.
GND
0V 0V 0V
Note: 1 VCC is the positive power supply of the device core and input circuitry. VCC voltage defines the input threshold and levels 2 VCCA is the positive power supply of the bank A outputs. VCCA voltage defines bank A output levels 3 VCCB is the positive power supply of the bank B outputs. VCCB voltage defines bank B output levels. VCCB is internally connected to 4 VCCC is the positive power supply of the bank B outputs. VCCC voltage defines bank C output levels.
Table 3: Function Table (Controls) Control
CCLK_SEL FSELA FSELB FSELC MR/OE
Default
0 0 0 0 0 CCLK0 fQA0:2 = fREF FQBO:2 = fREF FQCO:3 = fREF Outputs enabled
0
CCLK1 f QA0:2 = fREF /2 f QBO:2 = fREF /2 f QCO:3 = fREF /2
1
Internal reset Outputs disabled (tristate)
Table 4: Absolute Maximum Ratings1 Symbol
VCC VIN VOUT IIN IOUT TS Supply Voltage DC Input Voltage DC Output Voltage DC Input Current DC Output Current Storage temperature -65
Characteristics
Min
-0.3 -0.3 -0.3
Max
3.6 VCC+0.3 VCC+0.3 20 50 125
Unit
V V V mA mA C
Condition
Note: 1 These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability.
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
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Table 5: General Specifications Symbol
VTT MM HBM LU CPD CIN
ASM2I99446
Characteristics
Output Termination Voltage ESD Protection (Machine Model) ESD Protection (Human Body Model) Latch-Up Immunity Power Dissipation Capacitance Input Capacitance
Min
200 2000 200
Typ
VCC /2
Max
Unit
V V V mA
Condition
10 4.0
pF pF
Per output
Table 6: DC CHARACTERISTICS (VCC = VCCA = VCCB = VCCC = 3.3V 5%, TA = -40C to +85C)
Symbol VIH VIL IIN VOH VOL ZOUT ICCQ3 Characteristics Input High Voltage Input Low Voltage Input Current 1 Output High Voltage Output Low Voltage Output Impedance Maximum Quiescent Supply Current 14 - 17 2.0 2.4 0.55 0.30 Min 2.0 -0.3 Typ Max VCC + 0.3 0.8 200 Unit V V A V V V mA Condition LVCMOS LVCMOS VIN=GND or VIN=VCC IOH=-24 mA2 3 IOL= 24mA IOL= 12mA All VCC Pins
transmission line
Note: 1 Input pull-up / pull-down resistors influence input current. 2 The ASM2I99446 is capable of driving 50 transmission lines on the incident edge. Each output drives one 50 parallel terminated to a termination voltage of VTT. Alternatively, the device drives up to two 50 series terminated transmission lines. 3 ICCQ is the DC current consumption of the device with all outputs open and the input in its default state or open.
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
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Table 7: AC CHARACTERISTICS (VCC = VCCA = VCCB = VCCC = 3.3V 5%, TA = -40C to +85C)1 Symbol
fref fMAX tP, REF tr, tf tPLH tPHL tPLZ, HZ tPZL, LZ tsk(O) tsk(PP) tSK(P) DCQ tr, tf Input Frequency Maximum Output Frequency Reference Input Pulse Width CCLK Input Rise/Fall Time Propagation delay Output Disable Time Output Enable Time Output-to-output Skew Within one bank Any output Bank, Same output divider Any output, Any output divider Device-to-device Skew Output pulse skew4 /1 output Output Duty Cycle /2 output Output Rise/Fall Time CCLK0,1 to any Q CCLK0,1 to any Q 2.2 2.2 2.8 2.8 /1 output /2 output
ASM2I99446
Characteristics
Min
0 0 0 1.4
Typ
Max
2502 2 250 125 1.03 4.45 4.2 10 10 150 200 350 2.25 200 53 55 1.0
Unit
MHz MHz MHz nS nS nS nS nS nS pS pS pS nS pS % % nS
Condition
FSELx=0 FSELx=1 0.8 to 2.0V
47 45 0.1
50 50
DCREF = 50% DCREF = 25%-75% 0.55 to 2.4V
Note: 1 AC characteristics apply for parallel output termination of 50 to VTT 2 The ASM2I99446 is functional up to an input and output clock frequency of 350MHz and is characterized up to 250MHz. 3 Violation of the 1.0nS maximum input rise and fall time limit will affect the device propagation delay, device-to-device skew, reference input pulse width, output duty cycle and maximum frequency specifications. 4 Output pulse skew is the absolute difference of the propagation delay times | tpLH - tpHL |.
Table 8: DC CHARACTERISTICS (VCC = VCCA = VCCB = VCCC = 2.5V 5%, TA = -40C to +85C) Symbol
VIH VIL VOH VOL ZOUT IIN ICCQ3
Characteristics
Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Output Impedance Input Current2 Maximum Quiescent Supply Current
Min
1.7 -0.3 1.8
Typ
Max
VCC + 0.3 0.7 0.6
Unit
V V V V A mA
Condition
LVCMOS LVCMOS IOH=-15 mA IOL= 15 mA VIN=GND or VIN=VCC All VCC Pins
1
17 - 202 200 2.0
Note: 1 The ASM2I99446 is capable of driving 50 transmission lines on the incident edge. Each output drives one 50 parallel terminated transmission line to a termination voltage of VTT. Alternatively, the device drives up to two 50 series terminated transmission lines per output. 2 Input pull-up / pull-down resistors influence input current. 3 ICCQ is the DC current consumption of the device with all outputs open and the input in its default state or open.
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
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Table 9: AC CHARACTERISTICS (VCC = VCCA = VCCB = VCCC = 2.5V 5%, TA = -40C to +85C)1,2 Symbol
fref fMAX tP, REF tr, tf tPLH tPHL tPLZ, HZ tPZL, LZ tsk(O) tsk(PP) tSK(P) DCQ tr, tf Input Frequency Maximum Output Frequency Reference Input Pulse Width CCLK Input Rise/Fall Time Propagation delay Output Disable Time Output Enable Time Output-to-output Skew Within one bank Any output Bank, Same output divider Any output, Any output divider Device-to-device Skew Output pulse skew5 Output Duty Cycle Output Rise/Fall Time /1 or /2 output 45 0.1 50 CCLK0,1 to any Q CCLK0,1 to any Q 2.6 2.6 /1 output /2 output
ASM2I99446
Characteristics
Min
0 0 0 1.4
Typ
Max
2503 2 250 125 1.04 5.6 5.5 10 10 150 200 350 3.0 200 55 1.0
Unit
MHz MHz MHz nS nS nS nS nS nS pS pS pS nS pS % nS
Condition
FSELx=0 FSELx=1 0.7 to 1.7V
DCREF = 50% 0.6 to 1.8V
Note: 1 AC characteristics apply for parallel output termination of 50 to VTT. 2 AC specifications are design targets, final specification is pending device characterization. 3 The ASM2I99446 is functional up to an input and output clock frequency of 350MHz and is characterized up to 250MHz. 4 Violation of the 1.0nS maximum input rise and fall time limit will affect the device propagation delay, device-to-device skew, reference input pulse width, output duty cycle and maximum frequency specifications. 5 Output pulse skew is the absolute difference of the propagation delay times: | tpLH - tpHL |.
Table 10: AC CHARACTERISTICS (VCC = 3.3V + 5%, VCCA, VCCB, VCCC = 2.5V + 5% or 3.3V + 5%, TA = -40C to +85C)1,2 Symbol
tsk(O) tsk(PP) tPLH,HL tSK(P) DCQ
Characteristics
Output-to-output Skew Within one bank Any output Bank, Same output divider Any output, Any output divider Device-to-device Skew Propagation delay Output pulse skew Output Duty Cycle
3
Min
Typ
Max
150 250 350 2.5
Unit
pS pS pS nS pS %
Condition
CCLK0,1 to any Q /1 or /2 output 45
See 3.3V table 250 50 55 DCREF = 50%
Note: 1 AC characteristics apply for parallel output termination of 50 to VTT. 2 For all other AC specifications, refer to 2.5V or 3.3V tables according to the supply voltage of the output bank. 3 Output pulse skew is the absolute difference of the propagation delay times: | tpLH - tpHL |.
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
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APPLICATIONS INFORMATION Driving Transmission Lines
The ASM2I99446 clock driver was designed to drive high speed signals in a terminated transmission line environment. To provide the optimum flexibility to the user the output drivers were designed to exhibit the lowest impedance possible. With an output impedance of less than 20 the drivers can drive either parallel or series terminated transmission lines. In most high performance clock networks point-to-point distribution of signals is the method of choice. In a point-to-point scheme either series terminated or parallel terminated transmission lines can be used. The parallel technique terminates the signal at the end of the line with a 50 resistance to VCC/2. This technique draws a fairly high level of DC current and thus only a single terminated line can be driven by each output of the ASM2I99446 clock driver. For the series terminated case however there is no DC current draw, thus the outputs can drive multiple series terminated lines. Figure 3. "Single versus Dual Transmission Lines" illustrates an output driving a single series terminated line versus two series terminated lines in parallel. When taken to its extreme the fanout of the ASM2I99446 clock driver is effectively doubled due to its capability to drive multiple lines.
ASM2I99446 OUTPUT BUFFER IN 14 RS=36 Z0=50 OUTA
ASM2I99446
impedance mismatch seen looking into the driver. The parallel combination of the 36 series resistor plus the output impedance does not match the parallel combination of the line impedances. The voltage wave launched down the two lines will equal: VL = VS ( Z0 / (RS+R0 +Z0)) Z0 = 50 || 50 RS = 36 || 36 R0 = 14 VL = 3.0 ( 25 / (18+14+25)) = 1.31V At the load end the voltage will double, due to the near unity reflection coefficient, to 2.5V. It will then increment towards the quiescent 3.0V in steps separated by one round trip delay (in this case 4.0nS).
OutA tD = 3.8956 OutB tD = 3.9386
3.0 2.5 VOLTAGE (V) 2.0
In 1.5 1.0 0.5 0 2 4 6 8 10 12 14 TIME (nS)
ASM2I99446 OUTPUT BUFFER IN 14
RS=36
Z0=50 OUTB0
Figure 4. Single versus Dual Waveforms
Since this step is well above the threshold region it will not cause any false clock triggering, however designers may be uncomfortable with unwanted reflections on the line. To better match the impedances when driving multiple lines the situation in Figure 5. "Optimized Dual Line Termination" should be used. In this case the series terminating resistors are reduced such that when the parallel combination is added to the output buffer impedance the line impedance is perfectly matched.
ASM2I99446 OUTPUT BUFFER IN 14 RS=22 RS=22 Z0=50
RS=36
Z0=15 OUTB1
Figure 3. Single versus Dual Transmission Lines
The waveform plots in Figure 4. "Single versus Dual Line Termination Waveforms" show the simulation results of an output driving a single line versus two lines. In both cases the drive capability of the ASM2I99446 output buffer is more than sufficient to drive 50 transmission lines on the incident edge. Note from the delay measurements in the simulations a delta of only 43pS exists between the two differently loaded outputs. This suggests that the dual line driving need not be used exclusively to maintain the tight output-to-output skew of the ASM2I99446. The output waveform in Figure 4 "Single versus Dual Line Termination Waveforms" shows a step in the waveform. This step is caused by the
Z0=50
14 + 2222 = 5050 25 = 25
Figure 5. Optimized Dual Line Termination
2.5V and 3.3V LVCMOS Clock Distribution Buffer
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Pulse Generator Z=50 Z0=50 ASM2I99446
ASM2I99446
Z0=50
RT=50
RT=50
VTT
Figure 6. CCLK0, 1 ASM2I99446 AC test reference for VCC = 3.3V and VCC = 2.5V
VCC CCLK VCC = 3.3V VCC = 2.5V 2.4 0.55 tF tR 1.8V 0.6V QX t(LH) t(HL) VCC /2 GND VCC VCC /2 GND
Figure 7. Output Transition Time Test Reference
Figure 8. Propagation Delay (tPD) Test Reference
VCC CCLK VCC /2 GND VCC
VCC VCC /2 GND VOH VCC /2 tSK(LH) tSK(HL) GND
QX t(LH) t(HL) tSK(P) tPLH- tPHL
VCC /2 GND
The pin-to-pin skew is defined as the worst case difference in propagation delay between any similar delay path within a single device
Figure 10. Propagation Delay (tSK(P)) Test Reference
Figure 9. Output-to-Output Skew tSK(LH,HL)
VCC VCC /2 GND
TJIT(CC) = |TN -TN + 1|
tP T0 DC (tP /T0 100%)
TN
TN + 1
The variation in cycle time of a signal between adjacent cycles, over a random sample of adjacent cycle pairs
Figure 12. Cycle-to-Cycle Jitter
The time from the PLL controlled edge to the non-controlled edge, divided by the time between PLL controlled edges, expressed as a percentage.
Figure 11. Output Duty Cycle (DC) Reference
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
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Power Consumption of the ASM2I99446 and Thermal Management
The ASM2I99446 AC specification is guaranteed for the entire operating frequency range up to 250MHz. The ASM2I99446 power consumption and the associated long-term reliability may decrease the maximum frequency limit, depending on operating conditions such as clock frequency, supply voltage, output loading, ambient temperature, vertical convection and thermal conductivity of package and board. This section describes the impact of these parameters on the junction temperature and gives a guideline to estimate the ASM2I99446 die junction temperature and the associated device reliability.
ASM2I99446
Where ICCQ is the static current consumption of the ASM2I99446, CPD is the power dissipation capacitance per output, ()CL represents the external capacitive output load, N is the number of active outputs (N is always 12 in case of the ASM2I99446). The ASM2I99446 supports driving transmission lines to maintain high signal integrity and tight timing parameters. Any transmission line will hide the lumped capacitive load at the end of the board trace, therefore, CL is zero for controlled transmission line systems and can be eliminated from equation 1. Using parallel termination output termination results in equation 2 for power dissipation. In equation 2, P stands for the number of outputs with a parallel or thevenin termination, VOL, IOL, VOH and IOH are a function of the output termination technique and DCQ is the clock signal duty cycle. If transmission lines are used CL is zero in equation 2 and can be eliminated. In general, the use of controlled transmission line techniques eliminates the impact of the lumped capacitive loads at the end lines and greatly reduces the power dissipation of the device. Equation 3 describes the die junction temperature TJ as a function of the power consumption. Where Rthja is the thermal impedance of the package (junction to ambient) and TA is the ambient temperature. According to Table 11, the junction temperature can be used to estimate the long-term device reliability. Further, combining equation 1 and equation 2 results in a maximum operating frequency for the ASM2I99446 in a series terminated transmission line system, equation 4.
Table 11. Die junction temperature and MTBF
Junction temperature (C) 100 110 MTBF (Years) 20.4 9.1
120 4.2 130 2.0 Increased power consumption will increase the die junction temperature and impact the device reliability (MTBF). According to the system-defined tolerable MTBF, the die junction temperature of the ASM2I99446 needs to be controlled and the thermal impedance of the board/package should be optimized. The power dissipated in the ASM2I99446 is represented in equation 1.
2.5V and 3.3V LVCMOS Clock Distribution Buffer
Notice: The information in this document is subject to change without notice.
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TJ,MAX should be selected according to the MTBF system requirements and Table 11. Rthja can be derived from Table 12. The Rthja represent data based on 1S2P boards, using 2S2P boards will result in a lower thermal impedance than indicated below.
ASM2I99446
If the calculated maximum frequency is below 350 MHz, it becomes the upper clock speed limit for the given application conditions. The following eight derating charts describe the safe frequency operation range for the ASM2I99446. The charts were calculated for a maximum tolerable die junction temperature of 110C (120C), corresponding to an estimated MTBF of 9.1 years (4 years), a supply voltage of 3.3V and series terminated transmission line or capacitive loading. Depending on a given set of these operating conditions and the available device convection a decision on the maximum operating frequency can be made.
Table 12. Thermal package impedance of the 32LQFP
Convection, LFPM Still air 100 lfpm 200 lfpm 300 lfpm 400 lfpm 500 lfpm Rthja (1P2S board), C/W 86 76 71 68 66 60 Rthja (2P2S board), C/W 61 56 54 53 52 49
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Package Information 32-lead TQFP Package
ASM2I99446
SECTION A-A
Dimensions Symbol
A A1 A2 D D1 E E1 L L1 T T1 b b1 R0 a e
Inches Min Max
.... 0.0020 0.0374 0.3465 0.2717 0.3465 0.2717 0.0177 0.0035 0.0038 0.0118 0.0118 0.0031 0 0.0472 0.0059 0.0413 0.3622 0.2795 0.3622 0.2795 0.0295 0.0079 0.0062 0.0177 0.0157 0.0079 7
Millimeters Min Max
... 0.05 0.95 8.8 6.9 8.8 6.9 0.45 0.09 0.097 0.30 0.30 0.08 0 0.8 BASE 1.2 0.15 1.05 9.2 7.1 9.2 7.1 0.75 0.2 0.157 0.45 0.40 0.2 7
0.03937 REF
1.00 REF
0.031 BASE
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32-lead LQFP Package
ASM2I99446
SECTION A-A
Dimensions Symbol
A A1 A2 D D1 E E1 L L1 T T1 b b1 R0 e a
Inches Min Max
.... 0.0020 0.0531 0.3465 0.2717 0.3465 0.2717 0.0177 0.0035 0.0038 0.0118 0.0118 0.0031 0 0.0630 0.0059 0.0571 0.3622 0.2795 0.3622 0.2795 0.0295 0.0079 0.0062 0.0177 0.0157 0.0079 7
Millimeters Min Max
... 0.05 1.35 8.8 6.9 8.8 6.9 0.45 0.09 0.097 0.30 0.30 0.08 0 1.6 0.15 1.45 9.2 7.1 9.2 7.1 0.75 0.2 0.157 0.45 0.40 0.20 7
0.03937 REF
1.00 REF
0.031 BASE
0.8 BASE
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Ordering Information Part Number
ASM2I99446-32-LT ASM2I99446-32-LR ASM2I99446G-32-LT ASM2I99446G-32-LR ASM2I99446-32-ET ASM2I99446-32-ER ASM2I99446G-32-ET ASM2I99446G-32-ER
ASM2I99446
Marking
ASM2I99446L ASM2I99446L ASM2I99446GL ASM2I99446GL ASM2I99446E ASM2I99446E ASM2I99446GE ASM2I99446GE
Package Type
32-pin LQFP, Tray 32-pin LQFP,Tape and Reel 32-pin LQFP, Tray, Green 32-pin LQFP, Tape and Reel, Green 32-pin TQFP, Tray 32-pin TQFP,Tape and Reel 32-pin TQFP, Tray, Green 32-pin TQFP,Tape and Reel, Green
Operating Range
Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial
Device Ordering Information
ASM2I99446G-32-LR
R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70
ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
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ASM2I99446
Alliance Semiconductor Corporation 2575, Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com
Copyright (c) Alliance Semiconductor All Rights Reserved Part Number: ASM2I99446 Document Version: 0.4
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003
(c) Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.
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